Dow Corning Sylgard 567 Primerless Silicone Encapsulant Black 210 mL Kit

Part number: 567 PRMLSS ENCAP A/B 210ML Manufacturer SKU: 4026168
Dow Corning Sylgard 567 Primerless Silicone Encapsulant Black 210 mL Kit
Quantity Price
1-3 $94.19 94.190000000 USD New Available 567 PRMLSS ENCAP A/B 210ML
4-15 $67.35 67.350000000 USD New Available 567 PRMLSS ENCAP A/B 210ML
16+ $63.11 63.110000000 USD New Available 567 PRMLSS ENCAP A/B 210ML
In Stock. Usually Ships in 1-2 Business Days.

Dow Corning Sylgard 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat curing, flowability, minimal shrinkage, low viscosity, and good dielectric properties. 210 mL Cartridge.

Dow Corning Sylgard 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat curing, flowability, minimal shrinkage, low viscosity, and good dielectric properties. 210 mL Cartridge.
Typical Use: Low cost primerless adhesion; encapsulation, protection of electrical/electronic devices.
Brand: Sylgard
Color: Black
Components: 2 part
Cure System: Heat
Cure Time: 120min @ 100 °C; 60min @ 125 °C; 15min @ 150 °C
Dielectric Strength: 525 V/mil
Hardness: 42 A
Key Specifications: MIL-PRF-23586F (Grade B2), Type I, Class IV, QPL, UL 94 V-0 If you require manufacturer certification to a certain spec, please request a quote as additional fees may apply. Ellsworth Adhesives is an ISO-9001 registered and AS9120 compliant distribut
Mix Ratio: 1:1 by volume; 1:1 by weight
Service Temperature: -45 to 200 °C
Shear Strength: 140
Specific Gravity: 1.23
Thermal Conductivity: 0.3 W/mK
Viscosity: 1,540
Volume Resistivity: 2.1 x 10^15 ohm-cm
Working Time: >3d @ room temperature