Dow DOWSIL™ TC-4525 Thermally Conductive Gap Filler 6.4 kg Kit

Part number: TC-4525 A/B 6.4KG KIT Manufacturer SKU: 99159093
Dow DOWSIL™ TC-4525 Thermally Conductive Gap Filler 6.4 kg Kit
Quantity Price
1 $377.02 377.020000000 USD New Limited Availability TC-4525 A/B 6.4KG KIT
2 $354.99 354.990000000 USD New Limited Availability TC-4525 A/B 6.4KG KIT
3+ $328.06 328.060000000 USD New Limited Availability TC-4525 A/B 6.4KG KIT
Lead times may vary. Please call 1-877-454-9224 to confirm availability AND delivery time. NON-RETURNABLE.

Dow DOWSIL™ TC-4525 Thermally Conductive Gap Filler is a two component, room temperature curing, silicone gel that is used to dissipate heat from electronic components. It offers long term stability, reliable cooling performance, and provides dielectric insulation. 6.4 kg Kit (2 3.2 kg Kits).

<p>Dow DOWSIL&trade; TC-4525 Thermally Conductive Gap Filler is a two component, room temperature curing, silicone gel that is used to dissipate heat from electronic components. It offers long term stability, reliable cooling performance, and provides dielectric insulation. 6.4 kg Kit (2 3.2 kg Kits).</p>
Typical Use: Used to dissipate heat from electronic components.
Brand: DOWSIL
Chemical Composition: Silicone
Color: Part A: White; Part B: Blue
Components: 2 part
Cure System: Room Temperature
Cure Time: 120 min @ 25 °C; 20 min @ 50 °C; 10 @ 80 °C
Dielectric Strength: 18 kV/mm
Hardness: 55 OO
Mix Ratio: 1:1
Service Temperature: -45 to 150 °C
Specific Gravity: 2.9
Thermal Conductivity: 2.6 W/mK
Viscosity: Part A: 207; Part B: 193; Mixed: 217
Volume Resistivity: 2.4e + 14 ohm-cm
Working Time: 40 min @ 25 °C

 

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