Loctite Henkel Macromelt® polyamide and polyolefin thermoplastics are ideal for protecting electronic assemblies. Low pressure injection molding is used to over-mold electronic components and circuit boards from environmental exposure. Processing cycles are very short relative to other encapsulant systems, typically taking less than one minute per mold cycle. Depending on part size, geometry and tool design, multiple parts can be made with each molding cycle.
Macromelt® resins are 100% solids, one-component systems, maximizing yield and minimizing loss or waste.
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