Product Details

285 BLACK 18 LB
Product Name:
Emerson and Cuming ECCOBOND 285 Thermally Conductive Adhesive Black 1 gal Pail
Part#:
285 BLACK 18 LB.
Description:

Emerson and Cuming ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag epoxy adhesive paste that has a low coefficient of thermal expansion and good bond strength. When cured with Catalyst 23 LV, Eccobond 285 can be used at cryogenic temperatures and has good thermal cycling properties. 1 gal Pail.

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$405.66
2
$312.36
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$271.79
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Product Information
Typical Use: Used for bonding metals and ceramic substrates in heat sink applications or any application that requires a thermally conductive adhesive.

Color/Appearance: Black
Product Name: Emerson and Cuming ECCOBOND 285 Thermally Conductive Adhesive Black 1 gal Pail
1 part or 2: 2 part
Base Chemistry: Epoxy
Cure Time: Catalyst 9: 16 to 24h @ 25 °C; 11: 8 to 16h @ 80 °C; Catalyst 23LV: 16 to 24h @ 25 °C
Dielectric Strength: Catalyst 9: 17.7 kV/mm; Catalyst 11: 17.7 kV/mm; Catalyst 23LV: 17.7 kV/mm
Flash Point: >93.3 °C
Mix Ratio: Catalyst 9: 100:8.5 by volume, 100:3.5 by weight; Catalyst 11: 100:9.9 by volume, 100:4 by weight; Catalyst 23LV: 100:17 by volume, 100:7.3 by weight
Service Temperature: Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C
Shear Strength Psi: Catalyst 11: 2,100 @ 25 °C
Specific Gravity: 2.4
Thermal Conductivity: Catalyst 9: 1.44 W/mK; Catalyst 11: 1.44 W/mK; Catalyst 23LV: 1.22 W/mK
Viscosity Cp: Thixotropic paste
Volume Resistance: Catalyst 9: 1 x 10^15 ohm-cm; Catalyst 11: 1 x 10^15 ohm-cm; Catalyst 23LV: 1 x 10^15 ohm-cm
Work Life/Pot Life: Catalyst 9: 45min; Catalyst 11: 4h; Catalyst 23LV: 60min

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